收藏本站
LHF16KTV
4.5.4 Device Geometry Definition
This field provides critical details of the flash device geometry.
Table 10. Device Geometry Definition
14
Offset
(Word Address)
27H
28H,29H
2AH,2BH
2CH
2DH,2EH
2FH,30H
Length
01H
02H
02H
01H
02H
02H
Description
Device Size
15H (15H=21, 2 21 =2097152=2M Bytes)
Flash Device Interface description
02H,00H (x8/x16 supports x8 and x16 via BYTE#)
Maximum Number of Bytes in Multi word/byte write
05H,00H (2 5 =32 Bytes )
Number of Erase Block Regions within device
01H (symmetrically blocked)
The Number of Erase Blocks
1FH,00H (1FH=31 ==> 31+1=32 Blocks)
The Number of "256 Bytes" cluster in a Erase block
00H,01H (0100H=256 ==>256 Bytes x 256= 64K Bytes in a Erase Block)
4.5.5 SCS OEM Specific Extended Query Table
Certain flash features and commands may be optional in a vendor-specific algorithm specification. The optional
vendor-specific Query table(s) may be used to specify this and other types of information. These structures are
defined solely by the flash vendor(s).
Table 11. SCS OEM Specific Extended Query Table
Offset
(Word Address)
31H,32H,33H
34H
35H
36H,37H,
38H,39H
3AH
3BH,3CH
3DH
3EH
Length
03H
01H
01H
04H
01H
02H
01H
01H
Description
PRI
50H,52H,49H
31H (1) Major Version Number , ASCII
30H (0) Minor Version Number, ASCII
0FH,00H,00H,00H
Optional Command Support
bit0=1 : Chip Erase Supported
bit1=1 : Suspend Erase Supported
bit2=1 : Suspend Write Supported
bit3=1 : Lock/Unlock Supported
bit4=0 : Queued Erase Not Supported
bit5-31=0 : reserved for future use
01H
Supported Functions after Suspend
bit0=1 : Write Supported after Erase Suspend
bit1-7=0 : reserved for future use
03H,00H
Block Status Register Mask
bit0=1 : Block Status Register Lock Bit [BSR.0] active
bit1=1 : Block Status Register Valid Bit [BSR.1] active
bit2-15=0 : reserved for future use
V CC Logic Supply Optimum Write/Erase voltage(highest performance)
50H(5.0V)
V PP Programming Supply Optimum Write/Erase voltage(highest performance)
50H(5.0V)
3FH
reserved Reserved for future versions of the SCS Specification
Rev. 2.0
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
LH28F160S5HNS-S1 IC FLASH 16MBIT 70NS 56SSOP
LH28F320S3HNS-ZM IC FLASH 32MBIT 110NS 56SSOP
LH28F320SKTD-ZR IC FLASH 32MBIT 70NS 48TSOP
LHF00L28 IC FLASH 16MBIT 70NS 48TSOP
LPM409 CHASSIS STNRD 4SLOT CHASSIS W/INPUT LEAD
LS15RB1201J04 POE SPLITTER 10.8W 12V @0.9A
LT1932ES6#TRMPBF IC LED DRIVR WHITE BCKLGT TSOT-6
LT1937ES5#TRMPBF IC LED DRIVR WHITE BCKLGT TSOT-5
相关代理商/技术参数
LH28F160S3HR-L10 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8/x16 Flash EEPROM
LH28F160S3HR-L13 制造商:未知厂家 制造商全称:未知厂家 功能描述:EEPROM|FLASH|1MX16/2MX8|CMOS|TSSOP|56PIN|PLASTIC
LH28F160S3HT-L10 制造商:Sharp Microelectronics Corporation 功能描述:NOR Flash Parallel 3V 16Mbit 2M/1M x 8bit/16bit 100ns 56-Pin TSOP
LH28F160S3HT-L10A 功能描述:IC FLASH 16MBIT 100NS 56TSOP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:96 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并联 电源电压:2.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP 包装:托盘
LH28F160S3HT-L13 制造商:未知厂家 制造商全称:未知厂家 功能描述:EEPROM|FLASH|1MX16/2MX8|CMOS|TSSOP|56PIN|PLASTIC
LH28F160S3HT-L75A 制造商:Sharp Microelectronics Corporation 功能描述:
LH28F160S3HT-TF 功能描述:IC FLASH 16MBIT 100NS 56TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M（8Mx32） 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:托盘 其它名称:Q2841869
LH28F160S3-L10 制造商:SHARP 制造商全称:Sharp Electrionic Components 功能描述:16-MBIT(2MBx8/1MBx16) Smart 3 Flash MEMORY
    • 我
    • 采购
    • 搜索
    • 会员